Introduction. (This introduction is not part of IEEE Std P, DraftStandard for a Common Mezza- The mezzanine card’s local bus can be PCI, SBus orother local buses as they are developed in the . Relationship Between VME, VME64 and VMEbus. .. Other Host PCB Mechanics. Compatibility – IEEE P PMC module which complies to PCI Local Bus Specification Revision Provides one multifunction interrupt. 5V signaling. Created for compact PCI Mezzanine Card site rack-based system designs, the read-writer’s form factor (PMC) conforms to the PMC IEEE P/Draft

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Should boards be designed for the 9U height, up to 4 CMC slots can be provided. TP is defined as some point on a mezzanine card’s PCB, near the connector s dtaft, that is used by the assembly equipment for the reference p138.61 of the connector s prior to soldering.

A single mechanical definition builds larger markets with many more unique functions being provided for the multitude of user applications, and at a lower price. The position of each mezzanine slot, with respect to the front edge of the host computer’s PCB is fixed. All mezzanine card standoffs those standoffs near P11 and P13 should be tied to circuit ground at both the mezzanine card and the host board to avoid any “antenna” effects and to minimize the ground difference between the host and mezzanine card.

Single wide mezzanine cards are 75 mm wide by mm deep by 8. Comments on standards and requests for interpretations should be addressed to: See chapter 6 of this draft standard for the required mappings.

These two sizes are listed in Table The second goal of this draft standard is to only have one mezzanine card mechanical definition for a specific type of local bus rather than having multiple mechanical implementations as has happened in the past.


Standoffs are required to be tied to the mezzanine card’s circuit ground.

Multibus I boards don’t use front panels. Since IEEE Standards represent a consensus of all concerned interests, it is important to ensure that any interpretation has also received the concurrence of a ;ci of interests.

Multiple mechanical implementations fragments the market and destroys economy of scale for manufacturing, engineering, sales and marketing. Each CMC shall be designed to accommodate a bezel.

Common Mezzanine Card – CMC – PH

Since the mezzanine card side 1 faces the host side 1, the power dissipated underneath the mezzanine card should be limited to prevent excessive heat build up in the area between the two.

See Table for this relationship.

If a CMC does not use all of the connectors, this space is open to be utilized by additional components. Occasionally questions may arise regarding the meaning of portions of standards as they craft to specific applications. These connectors shall be referred to as the receptacle, or “Jn” connector. See Figures and for location of these holes. If the reader needs more understanding of this grid structure and wants pxi know how it ties into the international metric measurement systems, the reader should ppci a copy of IEEE Not all applications will need all the connectors.

This is not a manufacturing dimension with a tolerance. This mechanical definition is based on IEEE For two slot hosts, the connector numbers shall be J11 through J14 and J21 through J This shoulder should be attached to the host and must present a clear hole that allows a fastener from the host side to be threaded into the mezzanine standoff.

PCI Bus, PC CardBus, PCMCIA, Reader Writer, Mezzanine PMC

When the need for interpretations is brought to the attention of the IEEE, the Institute will initiate action to prepare appropriate responses. This draft standard defines the mezzanine card mechanics for these types of applications.


It is recommended that mezzanine card vendors list the shock and vibration standards, and to which level s that are met in the product specifications. Designers must realize that if one side’s height is increased, the other side’s height is decreased accordingly, since the CMC envelope can not be changed. Note that warpage of the PCB shall be included in the component height on both sides.

The maximum height of this area depends on whether the reference plane of the mezzanine card is 10 mm or 13 mm above the host.

Since the mezzanine card side 1 faces the host, the power dissipated on side 1 is also limited to minimize heat build up between the host and the mezzanine card. Each CMC card will receive these signals and use the information to both set the logical protocol it uses on the bus and indicate back to the host module its presence if it can support that logical protocol. The bezel always maintains the same relationship with the host’s side 1 surface and host front panel face plate.

A P P E N D I X A – Specifications

This section provides information on power sequencing and power requirements by connection phase. Draftt components on the solder side cover meet the limits of the CPCI specification for maximum height. This additional margin is 0. Therefore, there is very little chance that a small specification violation will impact an adjacent card in a PICMG 2.

This will vary depending on whether a 10 mm or 13 mm spacing is used. The two voltage are 5V and 3. Any table entry that was changed will have a thicker vertical line on the right side of changed entry.